From Extreme Conditions to Extreme Purity

Across modern industry, sealing materials are expected to withstand extreme temperatures, aggressive chemicals, and increasingly demanding operating conditions. To address these challenges, Freudenberg Sealing Technologies developed the Simriz® family of FFKM materials. Combining near-universal chemical resistance with the elasticity of an elastomer, Simriz® compounds are used wherever process reliability, safety, and equipment uptime are critical.

Today, Simriz® materials support demanding applications across industries ranging from oil and gas and food & beverage to semiconductor manufacturing. Built on Freudenberg Sealing Technologies’ proprietary material technology and vertical integration from monomer to finished seal, the portfolio offers solutions tailored to specific application needs while maintaining the high levels of thermal and chemical resistance associated with premium FFKM materials.

Building on this foundation, the latest addition to the portfolio is Simriz® 503, a next-generation ultrapure FFKM material developed specifically for advanced semiconductor manufacturing. As device geometries shrink and process requirements become increasingly stringent, sealing materials must do more than resist chemicals and temperature. They must also support contamination control and process stability in highly sensitive manufacturing environments.

To meet these demands, Freudenberg Sealing Technologies developed Simriz® 503 as a filler-free, ultra-high-purity FFKM compound. The material combines exceptionally low outgassing, low metal ion content and minimal particle generation with excellent resistance to plasma erosion, aggressive process chemistries, and temperatures up to +325°C. Designed for high-energy plasma environments and demanding thermal processes, it helps maintain long-term sealing performance while reducing contamination risks.

A key differentiator of Simriz® 503 is its ultra-clean formulation. ICP-MS Testing has demonstrated low metal ion content, while residual gas analysis confirmed extremely low outgassing behavior for maximum vacuum integrity. Combined with its resistance to plasma attack, the material helps minimize particle emission within critical process environments, supporting higher process consistency and yield.

Simriz® 503 is designed for critical semiconductor applications including deposition technologies such as CVD and PECVD, metallization processes such as PVD and sputtering, as well as plasma etching, ashing, diffusion and rapid thermal processing. Its combination of purity, thermal stability and plasma resistance enables reliable sealing integrity across multiple process steps while helping fabs maintain stringent cleanliness standards.

With Simriz® 503, Freudenberg Sealing Technologies expands its Simriz® portfolio with a material specifically developed for the next generation of semiconductor manufacturing, combining purity, plasma resistance, thermal stability and sealing reliability in a single solution.

For more information visit fst.com

Email: donna.thompson-gough@fst.com
Tel.    +44 1332524415
Tel.    +44 7851121882

Search related valve / actuator articles:   Freudenberg Sealing Technologies LtdIssue 107Seals